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Atomistic simulation of Ni-Pd alloy sputtering by 0.5-50keV Ar ionsстатья
Информация о цитировании статьи получена из
Web of Science,
Scopus
Дата последнего поиска статьи во внешних источниках: 18 июля 2013 г.
- Автор: Shulga V.I.
- Журнал: Radiation Effects and Defects in Solids: Incorporating Plasma Science and Plasma Technology
- Том: 164
- Номер: 1
- Год издания: 2009
- Первая страница: 1
- Последняя страница: 7
- DOI: 10.1080/10420150802164339
- Аннотация: Sputtering of Ni5Pd and NiPd5 alloys by 0.5-50keV Ar ions has been studied by means of binary-collision simulation. Special attention was given to the angular distributions of sputtered atoms at the steady-state conditions and to the relevant concentrations of Ni and Pd surface atoms, SNi and SPd, respectively. The simulation results were compared with the experimental data published recently. The best-fit values of SNi and SPd favor segregation of Pd in Ni5Pd and segregation of Ni in NiPd5. For a Ni5Pd alloy, it is expected that the ratio SNi/SPd will increase with energy, at least up to 10-20keV.
- Добавил в систему: Шульга Владимир Иванович