Modelling of some mechanism of metal electroplasticity under pulsed high-energy electromagnetic field actionстатья

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Дата последнего поиска статьи во внешних источниках: 3 сентября 2019 г.

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1. KukudzhanovLevitin_2019_J._Phys.__Conf._Ser._1205_012032.pdf KukudzhanovLevitin_2019_J._Phys.__Conf._Ser._1205_012032.pdf 683,8 КБ 21 мая 2019 [alex_lev]

[1] Kukudzhanov K. V., Levitin A. L. Modelling of some mechanism of metal electroplasticity under pulsed high-energy electromagnetic field action // Journal of Physics: Conference Series. — 2019. — Vol. 1205. — P. 012032. The processes of evolution of microcracks and micropores occurring in the material during processing of metal specimens by short-term pulses of high-energy electromagnetic field (HEEMF) are considered. The study is done numerically on the basis of a coupled model of the action an intense electromagnetic field on a previously damaged thermoelastoplastic material with an ordered system of defects, which takes into account the melting and evaporation of the metal and the dependence of all its physical and mechanical properties on temperature. Simulation has shown that, under certain conditions, microcracks can be almost completely healed. There is welding of the cracks by simultaneously decreasing the length of the microcrack, ejecting a jet of molten metal from the crack tip into the crack and closing its edges. The influence of the geometry and orientation of microdefects in the process of their healing is investigated. Based on the simulation results, simple approximate dependencies of the metal damage under the influence of the HEEMF on its initial damage, the characteristic length of the microdefects and their slope are obtained. [ DOI ]

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