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Modern copper electrolyte holes for multi-layer printed circuit boardsтезисы доклада
- Авторы: Aleshina V., Grigoryan N., Zorin R., Rotar I.
- Сборник: VII INTERNATIONAL SCIENTIFIC CONGRESS INNOVATIONS 2021
- Серия: 5
- Том: 1
- Тезисы
- Год издания: 2021
- Место издания: VARNA, BULGARIA
- Первая страница: 86
- Последняя страница: 87
- Аннотация: This work is devoted to the study of the stage of galvanic copper plating of through-holes in multilayer printed circuit boards. Hole plating is one of the most difficult stages and requires high-tech electrolytes and equipment. The present study was carried out within the framework of the development of a domestic electrolyte for copper plating of PCB holes and is devoted to the study of the effect of the nature and concentration of brightening additives on the gloss of a copper coating.
- Добавил в систему: Алешина Венера Халитовна