Modifying Copper and Copper Alloy Surface with Depocolin and 5-Chloro-1,2,3-Benzotriazole from a Neutral Aqueous Solutionстатья
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Дата последнего поиска статьи во внешних источниках: 1 декабря 2021 г.
Аннотация:Depocolin is an effective passivator of CuNiFe 5-1copper alloy in a borate buffer containing0.010 mol/L NaCl, suppressing its anodic dissolutionat Сin ≥ 0.15 mmol/L. It notably impeded local depassivation of the alloy even when CI was added to thesolution in concentrations 1/4000 lower than that ofsodium chloride. The adsorption of depocolin from neutral buffer (рН 7.40) on the oxidized surfaces ofcopper and CuNiFe 5-1 alloy was described adequately by the Temkin equation with free energies ofadsorption ( ) = 68 and 78 kJ/mol, respectively, indicating the chemisorptive nature of interaction of depocolin with the surface.Prior modification of the surface of copper andCuNiFe 5-1 alloy via depocolin adsorption greatlyfacilitated the passivation of these metals with subsequent adsorption of 5-chloro-BTA in a neutral chloride solution and enhanced their protection againstlocal depassivation. Our XPS data showed that depocolin bonded to the surface of the alloy via the oxygenatoms of both carboxyl groups, and the porphyrin ringdid not participate in the formation of the metal complex on the electrode.