|
ИСТИНА |
Войти в систему Регистрация |
ИСТИНА ИНХС РАН |
||
Physicochemical Features of Biocorrosion of Copper and Products Based on It by Microfungiстатья Исследовательская статья
- Авторы: Belov D.V., Belyaev S.N., Yunin P.A.
- Журнал: Protection of Metals and Physical Chemistry of Surfaces
- Том: 59
- Год издания: 2023
- Издательство: Pleiades Publishing, Ltd
- Местоположение издательства: Road Town, United Kingdom
- Первая страница: 279
- Последняя страница: 294
- DOI: 10.1134/S2070205123700260
- Аннотация: Corrosion resistance of structural materials has become one of the most important aspects in the electronics industry. In particular, biodeterioration and biocorrosion lead to operational failures and high economic losses. Biocorrosion of copper and base materials applied for the production of printed circuit boards is studied in this work. The inevitable change in the properties and destruction of textolite and glass textolite that are used in the composition of radioelectronic components and are in contact with copper often results in violations of the performance of devices and equipment. An attempt to explain the role of biofilms of microfungi as the main factor of mycological corrosion of copper in the composition of some electronicindustry products is made in this work.
- Добавил в систему: Белов Денис Владимирович