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Modeling of the metal microstructure formation by local electrodeposition onto conducting substratesстатья
Информация о цитировании статьи получена из
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Статья опубликована в журнале из списка Web of Science и/или Scopus
Дата последнего поиска статьи во внешних источниках: 15 февраля 2024 г.
- Авторы: Volgin V.M., Kabanova T.B., Gnidina I.V., Davydov A.D.
- Журнал: Russian Journal of Electrochemistry
- Том: 59
- Номер: 9
- Год издания: 2023
- Издательство: Maik Nauka/Interperiodica Publishing
- Местоположение издательства: Russian Federation
- Первая страница: 635
- Последняя страница: 645
- DOI: 10.1134/S1023193523090112
- Аннотация: The formation of metal microstructures on metal substrates is theoretically analyzed by the exampleof local silver electrodeposition, using the numerical simulation of interrelated electrochemical andhomogeneous chemical reactions. The silver electrodeposition localization and rate are shown to depend onthe interrelation between full concentrations of ammonia, silver, and protons in solution. The ammonia relativeconcentration range is determined, which provided an acceptable combination of the silver electrodepositionlocalization and rate. By using some simplifications, the distributions of the concentrations of theparticipants in the reactions and the current density of silver ion reduction are numerically calculated for variousconcentrations of solution components and interelectrode distances. The degree of localization of metaldeposition is shown to depend on the distribution of the concentrations of electroactive silver cations and thenon-electroactive complex of this metal near the anode. The deposition rate was found to depend nonmonotonouslyon the interelectrode distances, which can be explained by difficulties in the reactants’ delivery atsmall interelectrode distances and increase of the fraction of the silver electroactive ions diffusing towardsolution bulk at large interelectrode distances.
- Добавил в систему: Давыдов Алексей Дмитриевич